Korean J. Met. Mater. 2023;61(1):28-32. Published online 2022 Dec 28
DOI:
https://doi.org/10.3365/KJMM.2023.61.1.28
Abstract
Nowadays, high-density electronic devices and component mounting have gained popularity. Because of the heat generated from these devices, efficiency of the electronic parts is significantly lowered and life time of these devices is considerably shortened. Therefore, it is very important to efficiently dissipate the heat generated from the device to.....
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